damascene例句
Cu electrodeposition is one of the most important technologies in the
Damascene fabrication of interconnects.
铜电沉积是互连“大马士革”(
Damascene)工艺中最为重要的技术之一.
Plasma - induced damage on 90 nm Cu dual
Damascene technology devices is investigated.
研究了等离子体工艺对90nm铜大马士革工艺器件的损伤.