“管壳”造句
图7所示为带状引线连接芯片和
管壳装配的工艺程序.
Figure 7 shows the sequence for tape bonding the chip and assembling the package.
以压缩机
管壳式冷却器为例, 分析了其失效原因.
Take compressor's intercooler for example, main reasons of failure is analyzed.
反向阻断四极型 可控硅 、半导体控制开关. 可显示或隐藏
管壳.
Thyristor , reverse - blocking tetrode - type ; semiconductor controlled switch. Envelope can be shown or hidden.